印制电路板焊锡金不熔的失效分析及改善

Failure analysis and improvement of Printed Circuit Board solder-gold non-melting

在印制电路板制造中,由于化镍浸金工艺拥有良好的平整性、焊接性、导电性、键合性及金(Au)本身稳定性好,不易被氧化的特点被广泛应用于印制电路板表面处理中。但由于化镍浸金工艺在实际的焊接操作过程中存在有多种焊接不良现象,如"黑垫"、金不熔;其中金不熔多归结为金面受到污染和金层本身出现质量问题;文章主要阐述一种印制电路板焊接失效,表象为金不熔的失效模式进行深入的剖析和改善研究。

In the printed circuit board manufacturing industry,the nickel impregnation process has good leveling,weldability,conductivity,bonding.And gold(Au)itself has good stability and is not easy to be oxidized so is widely used in the surface treatment of printed circuit board.However,due to the nickel leaching process in the actual welding process,there are a variety of welding defects,such as"black pad",gold non-melting etc.The gold surface is polluted and the gold layer itself has the quality problem.This paper mainly describes a kind of printed circuit board welding failure and improvement method.