摘要
本文介绍了废电路板资源化现状,按照废电路板拆解顺序,总结了废电路板脱焊和元器件分离技术,阐明了各种熔焊技术的原理和特点;按不同的分类方法总结了元器件分离技术,分析了插装元器件和贴装元器件分离施加力的形式;针对选择性拆解和同时性拆解,总结了国内外最新的研究。研究表明,废电路板处理将朝着自动化、无人化的方向发展,降低基于图像的废电路板处理技术成本将有助于资源化进程。
In this paper,the current situation of waste circuit board resource utilization is introduced,according to the disassembly sequence of waste circuit boards,the technology of desoldering and component separation of waste circuit boards is summarized,and the principles and characteristics of various welding technologies are explained;according to different classification methods,the component separation technology is summarized,and the form of separating the applied force between the plug-in component and the mounted component is analyzed;for selective dismantling and simultaneous dismantling,the latest research at home and abroad is summarized.Studies have shown that the disposal of waste circuit boards will move towards automation and unmanned development,and reducing the cost of image-based waste circuit board processing technology will help the process of resource utilization.
作者
史志贺
戴国洪
周自强
SHI Zhihe;DAI Guohong;ZHOU Ziqiang(School of Mechanical Engineering,Jiangsu University of Technology,Changzhou 21300,China;Jiangsu Key Laboratory of Recycling and Reuse Technology for Mechanical and Electronic Products;School of Mechanical Engineering,Changshu Institute of Technology,Changshu 215500,China)
出处
《中国资源综合利用》
2021年第8期112-114,共3页
China Resources Comprehensive Utilization
基金
江苏省研究生科研与实践创新计划项目(SJCX19_0711)。
关键词
废电路板
电子元器件
拆解
waste circuit boards
electronic components
disassembly
