摘要
采用磁性复合流体(MCF)对BK7玻璃进行定点抛光实验,对抛光斑进行三维模型重构,并对磁场空间分布进行仿真与实验分析,阐明抛光材料去除机理,确定材料去除率、表面粗糙度及硬度随抛光时间的变化规律,建立了材料去除量与磁通密度的关系曲线。实验结果表明:抛光形成的抛光斑表面轮廓为蝶形,其沿抛光轮轴向的截面轮廓呈“W”形;材料去除量与磁场强弱及抛光时间密切相关,抛光深度去除率最高可达553 nm/min;表面粗糙度随抛光时间的增加先上升后下降,MCF抛光可获得表面粗糙度Ra<6 nm的光滑表面,且粗糙度与硬度呈现一定的正相关关系。
The fixed-point polishing experiment of BK7 glass was carried out by using magnetic compound fluid(MCF).By building the three-dimensional model of polishing spot and simulating the spatial distribution of magnetic field,the material removal mechanism of MCF polishing was explained,and the variation of material removal rate,surface roughness and hardness with polishing time was determined.The relationship between material removal depth and magnetic flux density was established.The experimental results show that the surface profile of the polishing spot is"butterfly"shape and the cross-section profile along the axial direction of the polishing wheel is"W"shape.The material removal rate is closely related to magnetic field and polishing time,and the highest removal rate about polishing depth is 553 nm/min.The surface roughness first increases and then decreases with the increase of polishing time.The smooth surface with Ra roughness less than 6 nm can be produced by MCF polishing,and there is a positive correlation between roughness and hardness.
作者
叶卉
李晓峰
段朋云
焦德礼
艾今朝
罗辉
姜晨
YE Hui;LI Xiaofeng;DUAN Pengyun;JIAO Deli;AI Jinzhao;LUO Hui;JIANG Chen(School of Mechanical Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China)
出处
《上海理工大学学报》
CAS
CSCD
北大核心
2021年第4期342-348,共7页
Journal of University of Shanghai For Science and Technology
基金
国家自然科学基金资助项目(51475310)
上海市青年扬帆科技英才计划项目(18YF1417700)
上海理工大学教师教学发展研究项目(CFTD212007)
上海理工大学2020年第一批科研项目课程。
关键词
磁性复合流体抛光
磁场分布
材料去除率
粗糙度
硬度
magnetic compound fluid polishing
magnetic field distribution
material removal rate
roughness
hardness