高职院校集成电路封测技术人才培养探索

Exploration on Talent Cultivation of Integrated Circuit Packaging and Testing in Higher Vocational Colleges

集成电路封装与测试产业对于高职院校培养的技能型人才有大量需求,然而毕业生质量却不尽人意。在对无锡、常州的3家大型封装与测试企业生产现状进行深入调研后,认为高职院校需要在立体化知识结构体系、无缝衔接顶岗实习制度、职业素质教育内容等方面做出改进,以适应我国封装与测试产业的人才需求。

The integrated circuit packaging and testing enterprises have a large demand for skilled student in higher vocational colleges,but the quality of the graduates is not satisfactory.After an in-depth investigation on three large packaging and testing enterprises in Wuxi and Changzhou,it is believed that higher vocational colleges should make progress in three-dimensional knowledge structure system,seamless internship system and vocational quality education content to meet the demand of talents in packaging and testing enterprises.