基于铜镍二级海参状微纳米层的固态键合方法

Solid state bonding method based on Cu-Ni secondary sea cucumber like micro-nano layer

提出一种基于铜镍二级海参状微纳米层的固态键合方法。将两块基板具有海参状铜镍微纳米层的表面相互接触以形成接触区域,再在加热条件下对接触区域施加压力进行键合,其中,海参状铜镍微纳米层包括铜针层以及镀覆于该铜针层表面的镍针层,铜针层为锥形铜微米针形成的阵列层,镍针层包括锥形镍纳米针形成的阵列层以及在这些锥形镍纳米针上形成的突起。通过扫描电子显微镜和透射电子显微镜及焊接强度测试仪器分别分析了互连界面的显微组织形貌变化、键合机制和剪切强度变化趋势。结果表明:这种固态键合方法能获得高强度的互连作用力。

A solid-state bonding method based on Cu Ni secondary sea cucumber like micro nano layer was proposed.The surfaces of the two substrates with a sea cucumber like Cu Ni micro-nano layer were contacted with each other to form a contact area,and then pressure was applied to the contact area under heating conditions to bond.The sea cucumber like Cu Ni micro-nano layer included a copper needle layer and a nickel needle layer plated on the surface of the copper needle layer.The copper needle layer was an array layer formed by a tapered copper microneedle,and the nickel needle layer included an array layer formed by a tapered nickel nanoneedle and a protuberance.The microstructure,bonding mechanism and shear strength of the interface were analyzed by scanning electron microscope,transmission electron microscope and welding strength testing instrument.The results shown that this solid state bonding method can obtain high strength interconnection force.