BMI-5100双马来酰亚胺树脂的固化动力学研究

Study on curing kinetics of BMI-5100 bismaleimide resin

采用示差扫描量热法(DSC)研究了BMI-5100双马来酰亚胺树脂及其加入质量分数5%的双叔丁基过氧异丙基苯(BIBP)固化剂体系的固化反应动力学。通过线性拟合得到BMI-5100树脂体系的特征温度及固化动力学参数。结果表明:纯BMI-5100的非等温固化DSC曲线呈现单峰反应,其凝胶温度、固化温度和后处理温度分别为216.5,277.1,317.5℃,表观活化能E为90.7 kJ/mol,指前因子A为5.3×10^(7)、反应级数n为0.872。含固化剂体系的固化过程出现了2个固化峰,第1固化峰所对应的凝胶温度、固化温度和后处理温度分别为143.1,150.1,164.2℃,第2固化峰相应温度分别为164.2,181.3,208.7℃,表明固化剂的加入可以明显降低BMI-5100树脂的固化温度并提高固化速率。

The curing reaction kinetics of pure BMI-5100 bismaleimide resin and the system containing 5 wt%curing agent bis-tertbutylperoxyisopropylbenzene(BIBP)were studied by DSC.The characteristic temperature and curing kinetic parameters of the BMI-5100 resin system were obtained by linear fitting.The results showed that the non-isothermal curing DSC curve of pure BMI-5100presented a unimodal reaction.The gel temperature,curing temperature and post-treatment temperature were 216.5,277.1,317.5℃,respectively,and the apparent activation energy E,frequency factor A and the reaction order n were 90.7 kJ/mol,5.3×10^(7) and 0.872,respectively.The curing process of the curing agent-containing system had two curing peaks.The gel temperature,curing temperature and post-treatment temperature corresponding to the first curing peak were 143.1,150.1,164.2℃,respectively,and those of the second curing peak were 164.2,181.3,208.7℃,respectively.The results showed that the addition of curing agent could significantly reduce the curing temperature of BMI-5100 resin and increase the curing rate.