摘要
不同于一般的半导体器件,光耦在工作原理、结构和封装设计等方面均具有特色。结合光耦的特色,阐述了光耦的几种常见的失效模式,如键合丝断开、粘接芯片的银迁移和芯片腐蚀等问题,并根据具体的使用环境分析了光耦器件失效的原因,以期在实际的使用过程中提高其可靠性。
Optical coupler is different from general semiconductor devices,which has its own characteristics in working principle,structure and packaging design.Combining with the characteristics of optical coupler,several common failure modes of optical coupler are explained,such as bond wire disconnection,silver migration of bonded chips and chip corrosion,and the reasons for device failure are obtained according to the specific use environment so as to improve the reliability of the device during actual use.
作者
徐军军
黄文锋
XU Junjun;HUANG Wenfeng(CEPREI,Guangzhou 511370,China)
出处
《电子产品可靠性与环境试验》
2021年第4期40-43,共4页
Electronic Product Reliability and Environmental Testing
关键词
光耦
键合丝断开
银迁移
芯片腐蚀
失效
可靠性
optical coupler
the bond wire broken
silver migration
chip corrosion
failure
reliability
