摘要
针对某系统级封装(SiP)开展失效分析。首先,基于用户提供的失效信息作出合理的初步判定,缩小失效模式范围;然后,对产品先后进行无损检测和破坏性检测,定位失效点并确定失效原因;最后,结合失效信息和检测结果对失效机理进行了阐述,并针对产品生产工艺提出了改进意见。
Failure analysis for a system-in-package(SiP)product is carried out.First,based on the failure information provided by the user,a reasonable preliminary judgment is taken to narrow the range of possible failure modes.Then,non-destructive and destructive detections are taken to find out the locations and causes of failure.Finally,the failure mechanisms are explained in combination with the failure information and test results,and suggestions for improvement of the production process are proposed.
作者
张玉兴
梁堃
何志刚
ZHANG Yuxing;LIANG Kun;HE Zhigang(Metrology and Testing Center,China Academy of Engineering Physics,Mianyang 621999,China;Microsystem and Terahertz Research Center,China Academy of Engineering Physics,Chengdu 610200,China)
出处
《电子产品可靠性与环境试验》
2021年第4期50-54,共5页
Electronic Product Reliability and Environmental Testing
关键词
系统级封装
失效分析
无损检测
破坏性检测
失效机理
SiP
failure analysis
non-destructive detections
destructive detections
failure mechanisms
