宇航抗辐射加固集成电路技术发展与思考

Development and Considerations for Aerospace Radiation-Hardened Integrated Circuit

宇航抗辐射加固集成电路是航天工程的核心基础技术。长期以来,美欧等国家对抗辐射加固集成电路持续支持并严格禁运,宇航集成电路的发展和自主可控是我国向航天强国迈进的关键核心基础之一,受到国家的高度重视。本文总结了宇航抗辐射加固集成电路发展特点和我国发展现状,分析了未来宇航抗辐射加固集成电路的发展需求,探讨了未来需要重点关注的3个技术方向,即软加固的天算芯片、高压功率器件加固和单粒子效应仿真。

Aerospace radiation-hardened integrated circuit(RHIC) is the core basic technology for aerospace engineering. For a long time,countries such as the United States have continued to support and strictly embargo RHIC. The development and independent control of RHIC are one of the key foundations for China to become a aerospace power,and they are highly valued by the country. In this paper,the development features of aerospace RHIC and the status of aerospace RHIC development in China are summarized,and the development requirements of future aerospace RHIC are analyzed. Based on the analysis,three advanced technical points which should be focused on in the future are discussed,i. e.,soft-hardened sky chip,hardened high-voltage and high-power device,and single event effect simulation.