腐蚀性电子气体中痕量水分的去除研究进展

Research Progress on Removal of Trace Moisture in Corrosive Electronic Gas

电子级氯化氢(HCl)、溴化氢(HBr)和氟化氢(HF)等高纯气体是半导体领域不可或缺的原材料之一,作为芯片先进支撑的一类核心气体主要用于芯片制造中的硅片蚀刻等工艺。随着电子行业的飞速发展,对电子气体的纯度要求越来越高。HCl、HBr和HF电子气体具有腐蚀性和强烈的亲水性,且遇水后腐蚀性增强,损耗设备,影响气体纯度,因此对其纯化过程中水分杂质的去除提出了严苛的要求。介绍了近年来腐蚀性电子气体HCl、HBr和HF中痕量水分的去除工艺;展望了HCl、HBr和HF电子气体的发展前景。

High purity electronic gases such as hydrogen chloride(HCl),hydrogen bromide(HBr)and hydrogen fluoride(HF)are one of the indispensable raw materials in the semiconductor field.As a core gas for advanced chip support,they are mainly used for silicon wafer etching in the process of chip manufacturing.With the rapid development of the electronics industry,the purity requirements of the electronic gas are getting higher and higher.HCl,HBr and HF electronic gases are corrosive and hydrophilic,and their corrosiveness is increased when exposed to water to destroy the equipment,and reduce the gas purity.Therefore,strict requirements are put forward for the removal of moisture in the purification process.This paper introduces the removal technology of trace moisture in corrosive electron gas HCl,HBr and HF in recent years,and prospects the development of HCl,HBr and HF electron gas.