摘要
SAP系统是目前国际上主流的ERP软件应用系统,MES是车间生产活动管理及优化的硬件和软件的集合,它在整个企业信息集成系统中起着承上启下的作用,是实现信息管理与传递的桥梁。本文浅析了SAP和MES系统融合应用的方法及其成果。SAP和MES系统的集成应用,可以协助集成电路封装测试企业优化自身的数据管理、实现成品集成电路测试程序的自动指定,并且可以降低企业信息化系统的运营维护成本,对集成电路封装行业的发展有帮助。
SAP(systems,applications,and products in data processing)system is the mainstream ERP software application system in the world.MES(Manufacturing Execution System)is the collection of hardware and software for workshop production activity management and optimization.It plays a connecting role in the whole enterprise information integration system and is a bridge to realize information management and transmission.This paper analyzes the methods and important achievements of the integration of SAP and MES.The integrated application of SAP and MES system can help IC packaging and testing enterprises to optimize their own data management,realize the automatic specification of finished IC test procedures,and reduce the operation and maintenance costs of enterprise information system,which is of great significance to the development of IC packaging industry.
作者
董辰博
孟兴梅
郑志全
DONG Chen-bo;MENG Xing-mei;ZHENG Zhi-quan(TianshuiHuaTian Technology Co.Ltd.)
出处
《中国集成电路》
2021年第9期74-77,共4页
China lntegrated Circuit