稳定剂对线路板化学镀钯的影响

Effect of Stabilizer on Electroless Palladium Plating on Circuit Boards

为提高线路板上化学镀钯的稳定性,通过镀液稳定性测试、膜厚测试以及扫描电镜(SEM)、能谱(EDS)分析和X射线光电子能谱(XPS)分析等手段研究了稳定剂对镀液稳定性、镀速、镀层形貌以及镀金后镍腐蚀的影响。结果表明:丙烯酸浓度在0.050~0.300 mol/L范围内,随着浓度的增加,化学镀钯沉积速率总体上呈下降趋势;无机盐C浓度在1.000~7.000 mg/L能够大幅提高镀液稳定性,随含量的提高沉积速率呈现下降趋势。以丙烯酸浓度0.300 mg/L和无机盐浓度1.000 mg/L进行复配时,镀液稳定性强,沉积速率稳定,得到的钯镀层均匀细致,能够有效抑制镀金时产生镍腐蚀。

In order to improve the stability of electroless palladium plating on print circuit boards,the effect of stabilizers on the stability of the plating solution,the plating speed,the morphology of the coating and nickel corrosion after gold plating were studied by plating solution stability test,film thickness test,scanning electron microscope(SEM),energy dispersive spectroscopy(EDS)and X-ray photoelectron spectroscopy(XPS).Results showed that in the acrylic acid range of 0.050~0.300 mol/L,the deposition rate of electroless palladium plating was generally decreased with the increasing concentration of acrylic acid.At the same time,when the concentration of inorganic salt C was 1.000~7.000 mg/L,the stability of plating solution could be greatly improved,and the deposition rate decreased with the increase of content.With 0.300 mg/L acrylic acid and 1.000 mg/L inorganic salt,the plating solution showed good stability and stable palladium deposition rate.The obtained palladium coating was uniform and compact,which could inhibit nickel corrosion effectively during the gold plating.