高阻尼合金胶粘层合板阻尼特性研究

Research on damping characteristics of laminated plate with adhesively high damping alloy

考虑高阻尼合金胶粘层合板中高阻尼合金的阻尼迟滞特性和胶粘剂本构中固化时间影响的关系,进行粘贴阻尼合金板后层合板结构的非线性动力有限元建模。对不同胶粘剂固化时间的高阻尼合金层合板进行数值仿真分析,用有理分式正交多项法结合非线性优化方法对仿真数据进行处理,得到不同胶粘剂固化时间下高阻尼合金层合板的固有频率和模态阻尼比。通过与锤击法模态试验所得高阻尼合金层合板模态参数对比,验证了有限元仿真模型的合理性。通过数值仿真和试验结果分析发现:粘贴阻尼合金板后层合板结构阻尼比有大幅度提高;随着胶粘剂固化时间的增加,层合板阻尼性能增强,瞬态振动也可以得到更快地衰减。表明高阻尼合金层合板的阻尼性能与阻尼合金的应变幅值有关;阻尼合金的应变幅值越大,阻尼合金层合板模态阻尼比越大,对应结构的减振性能越佳。

In this paper, the nonlinear dynamic finite element modeling of laminated plate with adhesively high damping alloy is carried out considering the influence of damping hysteresis of high damping alloy and curing time on the constitutive properties of adhesive. Numerical simulation analysis is carried out for high-damping alloy laminated plates with different curing time of adhesive, and the simulation data are processed by rational fraction orthogonal polynomial method combined with the nonlinear optimization method to obtain the natural frequency and modal damping ratio. By comparing the modal parameters of the high damping alloy laminated plate with the modal test of hammering method, the rationality of the finite element simulation analysis is verified. Combining numerical simulation and experimental results, it is found that the damping ratio of the laminated plate structure is greatly improved after gluing the damping alloy plate. With the increase of adhesive curing time, the damping performance of laminated plates increases, and the transient vibration can be attenuated faster. Results show that the damping property of the high damping alloy laminated plate is related to the strain amplitude of the damping alloy. The greater the strain amplitude of the damping alloy is, the greater the modal damping ratio of the damping alloy laminated plate is, and the better the damping performance of the corresponding structure will be.