有机溶剂对Sn42Bi58低温锡膏润湿性能的影响

Effect of Organic Solvents on Wettability of Sn42Bi58 Low Temperature Solder Paste

试验选用不同的有机溶剂,合成了7组助焊膏,分别与Sn42Bi58合金的低温无铅焊粉配制成锡膏,并按标准进行润湿性能测试,研究有机溶剂对锡膏润湿性能的影响。研究结果表明:溶剂对Sn42Bi58 低温锡膏性能有至关重要的作用,以高沸点醚类为溶剂的锡膏润湿性能较差,以己二醇为溶剂的锡膏细腻有光泽、稳定性好,润湿性能好。

Different organic solvents are used in the experiment to synthesize seven groups of solder aid paste,which are prepared into solder pastes with low-temperature lead-free solder powder of Sn42Bi58 alloy respectively,and the wettability test is conducted according to the standard to study the effect of organic solvents on the wettability of the solder paste.The research results show that the solvent plays a vital role in the performance of Sn42Bi58 low-temperature solder paste.The solder paste with high boiling point ether as the solvent has poor wettability,and the solder paste with hexylene glycol as the solvent is fine and shiny,with good stability and wetting properties.