LCC光模块的返修焊接工艺

Repair Soldering Process of LCC Optical Module

LCC光模块具有体积小、可靠性高、电磁辐射小等特点,在短距离通信领域有广阔的应用前景。从LCC光模块的装联工艺入手,分析了LCC光模块的焊接难点,针对金属外壳与电路基板的热膨胀系数差异、光纤带导致定位困难、光纤下的焊盘难以焊接等问题,采用搪锡去金、预先在光纤下的焊盘涂敷Sn-Bi焊料、预先用Sn-Pb焊料固定光模块等方法,获得了良好的焊接效果,为LCC光模块的返修焊接过程提供了一种便捷、有效和高可靠的方法。

LCC optical module has the characteristics of small size,high reliability and low electromagnetic radiation,and has a broad application prospect in the field of short distance communication.Starting from the assembly process of LCC optical module,the soldering difficulties of LCC optical module are analyzed.Aiming at the problems such as difference in the coefficient of thermal expansion between metal shell and circuit board,the positioning difficulty caused by optical fiber,and the difficulty in soldering the solder pad under optical fiber,the good soldering effect is obtained by means of tinning and removing gold,pre-coating Sn-Bi solder on pad under optical fiber,and pre-fixing optical module with Sn-Pb solder,which provides a convenient,effective and high reliability method for the repair soldering process of LCC optical module.