摘要
系统级封装SiP(System in a Package)已成为后摩尔时代延续摩尔定律的主要技术路线,是未来电子装备小型化和多功能化的重要依托,在微纳电子设计和制造领域具有广阔的应用市场和发展前景。介绍了系统级封装技术的发展和应用情况,根据雷达信号处理系统芯片化、集成化、高能效、高可靠的发展需求,探讨了SiP技术在雷达信号处理系统中应用的可行性,提出了一种基于SiP技术的雷达信号处理微系统设计及实现,SiP产品比PCB板卡面积缩小60%以上。
SiP(System in a Package)has become the main technical route for the continuation of Moore’s law in the post-Moore’s law period.It is an important support for the future miniaturization and multi-function of electronic equipment,and has a wide application market and development prospect in the field of micro-nano electronic design and manufacturing.This paper has introduced the development and application of SiP technology.According to the development requirements of radar signal processing system with chip,integration,the feasibility of applying SiP technology in radar signal processing system is dicussed,and implementation of a radar signal processing microsystem based on SiP technology is proposed,in which thearea of SiP product is more than 60%smaller than the area of PCB.
作者
周海斌
何国强
ZHOU Haibin;HE Guoqiang(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)
出处
《遥测遥控》
2021年第5期70-76,共7页
Journal of Telemetry,Tracking and Command
