SiP陶瓷芯片水汽含量控制工艺方法研究

Analysis and control of excessive water vapor in SiP ceramic chip

结合宇航级陶瓷封装芯片的特点和水汽控制要求,对SiP陶瓷封装工艺进行了研究,分析了陶瓷封装过程中产生水汽的各个因素,优化了封装生产工艺流程,增加了预烘转运过程下厂监制,保证了转运时间的工艺过程管控,通过试验验证了管控措施的有效性。

In this paper,combined with the characteristics of aerospace ceramic packaging chip and water vapor control requirements,the SiP ceramic packaging process has been studied.The factors of water vapor in the ceramic packaging process have been analyzed,the packaging production process has been optimized,the factory supervision during the pre drying and transfer process has been added,and the process control of the transfer time has been ensured.The effectiveness of the control measures has been verified through experiments.