超声显微检测技术在电子封装中的应用与发展

Application and development of scanning acoustic microscopy testing technology in electronic packaging

超声显微检测技术应用于电子封装领域始于20世纪80年代,如今已是检测电子封装可靠性和完整性的重要手段,被广泛应用到了电子封装的缺陷检测和精密测量等方面。针对电子封装的超声显微检测存在回波重叠、信噪比低等问题,近年来,发展了许多时频分析方法,用于获得优于常规方法的纵向分辨率,即实现超分辨率。该文首先介绍了超声显微检测的发展历史,对其检测原理和分辨率理论进行了简述;其次,综述了超声显微检测技术在电子封装中的主要应用与发展现状;然后,对超声显微检测的超分辨率成像方法进行了综述,分别介绍了基于小波分析的反卷积、连续小波变换和稀疏表示在实现超分辨率时的原理及适用场景;最后,探讨归纳了电子封装超声显微检测的主要研究方向及难点。

The application of scanning acoustic microscopy testing technology in the field of electronic packaging began in the 1980 s. It is now an important means of testing the reliability and integrity of electronic packaging, and has been widely used in defect detection and precision measurement of electronic packaging. In view of the problems of echo overlap and low signal-to-noise ratio in the scanning acoustic microscopy testing of electronic packaging, many time-frequency analysis methods have been developed in recent years to obtain axial resolution, which is superior to conventional methods, that is, to achieve super-resolution. In this paper,the development history of scanning acoustic microscopy testing is introduced, and its detection principle and resolution theory are briefly described. Secondly, the main application and development status of scanning acoustic microscopy testing technology in electronic packaging are summarized. Then, the super-resolution imaging methods of scanning acoustic microscopy testing are summarized, and the principles and applicable scenarios of wavelet analysis based deconvolution, continuous wavelet transform and sparse signal representation in achieving super-resolution are introduced. Finally, the main research directions and difficulties of scanning acoustic microscopy testing of electronic packaging are discussed and summarized.