芯片用液态金属散热器的数值模拟

Numerical simulation of chip heat dissipation using liquid metal

计算机芯片功率的大幅度增加对芯片散热的要求越来越高,液态金属高导热性及流动性等使其成为极具潜力的冷却工质.为了研究圆管内液态金属散热器的散热特性,针对液态金属Ga_(68)In_(20)Sn_(12)和水,分别在不同圆管模型、流道内的换热进行数值模拟,比较分析了模型流道长度、雷诺数、管径对换热系数的影响.实验结果表明,Ga^(68)In_(20)Sn_(12)散热冷却系统设置过长的流道长度不能达到最理想的换热效果,增大管径起到的换热效率显著提升,明显优于管长影响;在U,S和M型圆管中,S型管道是解决热点问题的最优方案.

The power of computer chips has increased greatly,which makes the heat dissipation demand of chip higher and higher.Liquid metal is a potential cooling medium due to its high thermal conductivity and fluidity.In order to study the thermal characteristics of liquid metal radiator in a circular tube,the heat transfer of liquid metal Ga^(68)In_(20)Sn_(12) and water in different circular tube models and passages were numerically simulated,and the effects of channel length,Reynolds number and pipe diameters on the heat transfer coefficient were compared and analyzed.The experimental results show that setting too long runner length in the Ga^(68)In_(20)Sn_(12) cooling system can not achieve the optimal heat transfer effect,and the increase of pipe diameter can significantly improve the heat transfer efficiency,which is obviously better than the effect of pipe length.In U,S and M-type tubes,S-type pipes are the best solution to solve hot-spot problem.