3D打印封装光纤光栅传感器应变传递机理研究

Study on Strain Transfer Mechanism of Three Dimensions Printing Encapsulated Fiber Bragg Grating Sensor

采用3D打印方法开发光纤光栅应变传感器,建立裸光纤光栅传感器、3D打印封装层、被测基体三者之间的应变耦合传递的分离式模型,推导光纤光栅传感器与被测基体的应变传递关系,分析夹持式3D打印光纤光栅应变传感器应变传递率的影响因素,包括封装层弹性模量、封装层厚度、黏结长度。研究结果表明平均应变传递率与封装层弹性模量和黏结长度呈正相关,与封装层厚度呈负相关。研究成果对夹持式光纤光栅应变测量、误差修正和传感器设计,以及3D打印技术封装光纤布拉格光栅的可行性具有参考意义。

The fiber grating strain sensor is developed by using the 3D-printing method.A separate model of strain coupling and transmission between the bare fiber Bragg grating sensor,3D-printing encapsulation layer and the measured matrix structure is established.The strain transfer relationship between the fiber grating sensor and the measured matrix structure is deduced.The influencing factors of the strain transfer rate of the clamped 3D-printing fiber grating strain sensor are analyzed,including the elastic modulus of the encapsulation layer,the thickness of the encapsulation layer and the bonding length.The research results show that the average strain transfer rate is positively correlated with the elastic modulus and bonding length of the encapsulation layer,negatively correlated with the thickness of the encapsulation layer.The research results can be used as a reference for the clamped fiber Bragg grating strain measurement,error correction and sensor design,as well as the feasibility of 3D-printing technology for packaging fiber Bragg gratings.