打印机底壳翘曲变形分析及工艺参数正交优化

Warpage analysis of printer bottom shell and orthogonal optimization of process parameters

在打印机底壳模具设计制造之前,先采用Moldflow最佳浇口模块分析出最佳的进浇位置。采用Moldflow水路向导设计水路,发现深腔部位温度较高、凸凹模模温差较大、模温不均匀。增加隔水板之后,深腔部位温度降低,凸凹模温差在10℃以内;最后对工艺参数进行优化,采用正交实验法分析模具温度、熔体温度、保压压力、保压时间各因素对翘曲变形的影响程度,并得到最佳工艺方案。最终翘曲变形量为1.739mm,满足产品要求。

Moldflow software is used to predict and optimize the gate position before mold design and manufacturing.It is found that the temperature of deep cavity is higher,the temperature difference between punch and die is larger,and the temperature of die is uneven.After adding the baffle,the temperature of the deep cavity decreases,the temperature difference between the punch and the die is less than 10℃.Finally,the process parameters were optimized,and the influence degree of mold temperature,melt temperature,holding pressure and holding time was analyzed by orthogonal experiment method,and the best process scheme on warping deformation was obtained.The final warping deformation is 1.739 mm,which meets the product requirements.