铜工业电解条件下结瘤的生长行为研究

Nodulation Growth Behaviors Under the Conditions of Copper Industry Electrolysis

研究了在工业电解槽中利用人工铜柱模拟结瘤及其生长行为,考察了电解时间和结瘤初始高度对结瘤形貌和生长速率的影响。结果表明:阴极电流随极间距减小而显著增大;电解时间小于12 h,结瘤形貌变化不大;电解时间延长至24 h,7.5 mm是结瘤形貌显著变化的临界高度:当结瘤初始高度大于7.5 mm后,其顶端出现明显的冠状膨大;当阴极板表面的结瘤高度小于2.5 mm且电解时间小于12 h时,其径向生长速率较快;除此以外,均以轴向生长为主导。

Simulation of nodulation by use of the artificial copper column and its growth behavior in the industrial electrolytic cell were studied.the effects of electrolysis time and origin height of nodulation on the morphology and growth rate of nodulation were examined.The results show that the cathode current increase significantly with the decrease of electrode spacing.Nodulation morphology changes slightly for the electrolysis time<12 h.However,when the electrolysis time increases to as long as 24 h,7.5 mm is a critical height for the significant change of nodulation morphology.As a result,the top of nodulation expanded largely after the origin height of nodulation is above 7.5 mm.The growth rate of nodulation in the radial direction is faster when the height of nodulation formed on the surface of cathode plate is lower than 2.5 mm and the electrolysis time is shorter than 12 h.In addition,the growth in the axial direction is dominant.