高多层埋铜块印制板制作技术研究

Study on manufacturing technology of high multilayered and copper embedded PCB

埋铜块印制板将铜块埋嵌在板内,在实现基本传输信号和支撑功能的同时,还可以起到散热和节省板面空间的作用。文章研究以一款应用于通信基站的整体18层,集高多层、埋嵌铜块、背钻、树脂塞孔等设计的高多层埋铜块印制板产品为例,就其结构设计、制作工艺、生产难点及改善等做了详细阐述。

The copper embedded PCB,in which copper blocks are embedded or buried,plays the role of heat dissipation and saving board space,while realizing basic signal transmission and support function.This paper chose an 18-layer high multilayer and copper embedded PCB product used in communication base station,which gathers high multilayer,embedding copper,back drilling,resin plugging,etc.,and elaborated the structure design,manufacturing technological process,difficulties and improvements.