后摩尔时代芯片结构材料的热设计与表征

Thermal Design and Characterization of Chip Structure Materials in Post Moore Era

在半导体工业,摩尔定律预测每过2年芯片上晶体管的数量就增加一倍,芯片运行的速度也会增加一倍。目前,超高的热流密度已成为摩尔定律面临的一个瓶颈。微纳结构利用尺寸效应、界面效应和新的材料构成体系,有可能为半导体工业提供颠覆性的技术解决方案。系统研究尺寸效应、应变场和温度场对声子和电子输运规律的影响以及结构相变或尺寸效应对Wiedemann-Franz定律的影响,可以精确理解声子、电子在微纳结构上的输运规律,从而为半导体工业寻找新材料提供精准的技术路线图。

In the semiconductor industry,Moore’s law predicts that every two years the number of transistors on the chip will double and the operation speed of the chip will double,too.At present,the ultra-high heat flux has become a bottleneck of Moore’s law.With the help of multiple material composition,more interfaces and size effect,the micro-nano structure may provide revolutionary technological solutions for semiconductor industry.By systematically studying the influence of size effect,strain field and temperature field on phonon and electron transport law and the influence of structural phase transition or size effect on Wiedemann-Franz law,the transport laws of phonon and electron in the micro-nano structure can be accurately understood,thus providing an accurate technical roadmap for the semiconductor industry in finding new materials.