星载天线组件盲插互联装配技术研究

Research on Assembly Technology of Blind-mating for Modules in Satellite Antenna

随着星载电子装备向集成化、小型化、轻量化以及可快速维修的方向发展,组件盲插互联技术的应用越来越广泛。文中针对星载天线系统高密度组件盲插互联装配的质量问题,对组件的盲插互联结构以及盲插装配精度的影响因素进行了分析。根据分析结果,研制了盲插互联在位测量装置和压接装配装置,实现了盲插装配轴向间距的在位测量,保证了盲插互联的间隙控制和组件压接时的精确定位及导向。最后基于某星载电子装备天线系统的有源模块进行了装配试验,结果证明了文中装配技术的有效性。

With the development of satellite electronic equipment towards integration,miniaturization,light weight and fast maintainability,the application of blind-mating technology to modules is more and more widespread.Aiming at the assembly quality problems of high density blind-mating for modules in the satellite antenna system,this paper discusses the assembly structure and the influencing factors of the assembly accuracy of blind-mating.According to the analysis results,an in-situ measuring device and a crimping assembly device for blind-mating are developed.The devices realize the in-situ measurement for the axial spacing of the blindmating.The gap dimensions between the modules are precisely controlled by the in-situ measuring device,the positioning and the orientation between the modules are ensured by the crimping assembly device.Finally,the assembly tests are carried out on the active modules of a satellite antenna system,and the result proves the effectiveness of the proposed assembly technology.