期刊文献+

均匀热源条件下类叶状微通道矩形热沉的构形设计 被引量:2

Constructal Design of Rectangular Heat Sink with Leaf-Like Microchannel Under Uniform Heat Source
下载PDF
导出
摘要 针对均匀背景热流条件下的散热问题,构建了类叶状微通道矩形热沉模型,基于构形理论,在给定热沉体积与液冷通道总体积的约束条件下,以热沉最高温度和压降最小化为目标,以微通道单元数、主通道与分支通道的夹角、主通道与分支通道的管径比为设计变量进行了优化设计。结果表明:通过增加微通道单元数、减小主通道与分支通道的夹角、采用较小的主通道与分支通道之管径比,可以降低热沉的最高温度,但是会增大压降损失。 For the heat dissipation problem with uniform background heat flow,a leaf-like microchannel rectangular heat sink model was constructed.Based on the constructal theory,under the constraints of a given heat sink volume and the total volume of the liquid cooling channels,with the minimizations of maximum temperature and pressure loss of the heat sink as the objectives,the optimal designs are carried out with the element number of microchannels,the angle between the main channel to the branch channel,and the tube diameter ratio of the main channel to the branch channel as the design variables.The results show that,by increasing the element number of microchannels,reducing the angle between the main channel and the branch channel,and adopting a smaller tube diameter ratio of the main channel to the branch channel,the maximum temperature can be reduced,but the pressure loss increases.
作者 曲雪健 谢志辉 关潇男 夏少军 戈延林 QU Xuejian;XIE Zhihui;GUAN Xiaonan;XIA Shaojun;GE Yanlin(College of Power Engin.,Naval University of Engin.,Wuhan 430033,CHN;Institute of Thermal Science and Power Engin.,Wuhan Institute of Technology,Wuhan 430205,CHN;School of Mechanical&Electrical Engineering»Wuhan Institute of Technology,Wuhan 430205,CHN)
出处 《半导体光电》 CAS 北大核心 2021年第4期525-531,共7页 Semiconductor Optoelectronics
基金 国家自然科学基金项目(51979278,51579244,51506220)。
关键词 构形理论 电子器件散热 微通道热沉 热设计 constructal theory heat dissipation of electronic devices micro-channel heat sink thermal design
  • 相关文献

参考文献5

二级参考文献184

共引文献117

同被引文献8

引证文献2

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部