摘要
对纳米铜在电子封装领域的应用优势进行了简要分析,从材料制备、烧结技术和材料性能三个方面回顾了纳米铜性能调控技术的最新研究成果,评述了还原性稳定剂、表面配位诱导深度晶面重构以及核壳结构等纳米铜抗氧化技术的工程应用价值,分析了低温无压热烧结以及大气环境下的光子烧结的发展趋势。从应用模式和性能的视角介绍了纳米铜在高可靠全铜互连、下一代功率芯片键合以及新兴的柔性混合电子(FHE)等方面的应用进展、面临的挑战及尚待开展的研究。最后展望了纳米铜在电子封装领域规模化应用的前景并指出重点研究方向。
The application advantages of nano-copper in the field of electronic packaging are briefly analyzed. The latest research achievements of nano-copper performance control technology are reviewed from the aspects of material preparation, sintering technology and material properties. The engineering application values of nano-copper anti-oxidation technologies, such as reductive stabilizer, surface coordination induced deep lattice reconstruction and core-shell structure, are reviewed. The development trends of low-temperature pressureless thermal sintering and photo-nic sintering in atmospheric environment are analyzed. From the perspectives of application mode and performance, the application progresses, challenges and researches to be carried out for nano-copper in high-reliability all-copper interconnection, next-generation power die bonding and emerging flexible hybrid electronics(FHE) are introduced. Finally, the outlook of large-scale application of nano-copper in the field of electronic packaging is prospected and key research directions are pointed out.
作者
曾策
崔西会
廖承举
卢茜
吕英飞
Zeng Ce;Cui Xihui;Liao Chengju;Lu Qian;Lu Yingfei(The 29th Research Institute,China Electronics Technology Group Corporation,Chengdu 610036,China;Sichuan Broadband Microwave Circuit High Density Integration Engineering Research Center,Chengdu 610036,China)
出处
《微纳电子技术》
CAS
北大核心
2021年第10期866-874,共9页
Micronanoelectronic Technology
基金
装备发展部产品研制资助项目(2009ZYHW0011)。
关键词
纳米铜
电子封装
柔性混合电子(FHE)
功率芯片
烧结
键合
互连
nano-copper
electronic packaging
flexible hybrid electronics(FHE)
power die
sintering
bonding
interconnection
