纯铜研磨表面残余应力在液动压悬浮抛光中的松弛规律

Relaxation Rule of Residual Stress on Grinded Surface of Pure Copper during Hydrodynamic Suspension Polishing

为了探究液动压悬浮抛光工件表面的应力松弛规律,课题组利用有限元法建立了液动压悬浮抛光过程中单/多颗磨粒连续撞击工件的数值分析模型。在模型中引入了传统研抛加工后的工件表面粗糙度和残余应力参数值,分别探讨了单/多颗磨粒连续撞击情况下抛光转速对机械研磨后铜质工件中残余应力松弛的影响;选取经过传统研抛和传统研抛再液动压悬浮抛光的铜质工件试样,使用X射线衍射仪分别对铜质工件表面进行残余应力测试。测试结果验证了液动压悬浮抛光过程中单/多颗磨粒连续撞击工件的数值分析模型的正确性,表明液动压悬浮抛光过程对研磨表面的残余应力起到了良好松弛效果。该研究有益于在液动压悬浮抛光加工中改善工件表面应力状态。

Aiming at the relaxation rule of residual stress on the surface of hydrodynamic suspension polishing(HSP),the numerical analysis model of single/multiple abrasive particle impacting on a metallic component was established by using finite element method.The parameters of surface roughness and residual stress after traditional polishing were introduced into the model and the effects of polishing speed on the residual stress relaxation in copper workpiece after mechanical lapping in the case of continuous impact of single/multiple particles were investigated respectively.The residual stress on the copper workpiece surface after traditional polishing and the workpiece surface after traditional polishing and then HSP were tested by X-ray diffractometer.The results show that the accuracy of the parametric model of single/multiple particle impacting on a metallic component and the HSP process has a good relaxation effect on the residual stress of the grinded surface.This study is beneficial to improve the surface stress state of the workpiece in HSP process.