退火处理对铜导线晶界特征分布及导电性能的影响

Effect of annealing on grain boundary characteristics distribution and conductivity of copper wire

对拉拔法制备的工业纯铜导线进行不同参数下的退火处理,并采用电子背散射衍射(EBSD)技术对退火前后样品的晶界特征分布(GBCD)进行了测试。结果表明:退火处理后,铜导线导电率和特殊晶界比例均有一定的提高,导电率随Σ3晶界比例增大而提高,而晶粒尺寸对导电率没有明显的影响。550℃退火15 min时,特殊晶界比例达到最高值57.59%,Σ3晶界比例达到最高值49.80%,导电率可达59.29%IACS,是退火前的2.56倍。

Industrial pure copper wires prepared by the drawing method were annealed under different parameters,and the grain boundary characteristic distribution(GBCD)of the samples before and after annealing was tested by using electron backscatter diffraction(EBSD)technology.The results show that the conductivity and special grain boundary ratio of the copper wire are increased to a certain extent after annealing,and the conductivity increases with the Σ3 grain boundary ratio increasing,while the grain size has no obvious effect on conductivity.When annealed at 550℃ for 15 min,the proportion of special grain boundaries reaches the highest value of 57.59%,the proportion of Σ3 grain boundaries reaches the highest value of 49.80%,and the conductivity could reach 59.29% IACS,which is 2.56 times of that before annealing.