面向晶圆图的芯片定位方法

Chip Location Method for Wafer Map

针对在依据晶圆图进行芯片分选时出现的芯片错位问题,提出了一种面向晶圆图的芯片定位方法。基于晶圆上芯片分布特点,采用跳点优化后的A*算法进行路径规划,搜寻绕过工艺控制监测器(PCM)区域的最优路径,并按芯片的理论间隔距离移动,实现粗略定位;采用改进后的LINE 2D形状匹配算法对当前位置进行亚像素精度级的校正,实现精确定位。选择不同规格的晶圆在芯片分选机上进行多次实验,所提出的方法可基本解决芯片错位的问题,同时可提高芯片定位精度,满足芯片生产需求。

A chip location method for wafer map was proposed for the problem of chip dislocation during chips sorting based on wafer map.Based on the characteristics of chip distribution on the wafer,the A*algorithm optimized by jumping points was used to plan the optimal path that can bypass the process control monitor(PCM)area.Moving according to the theoretical interval distance of chips,rough positioning was carried out.The improved LINE 2D shape matching algorithm was used to correct the current position at the sub pixel accuracy level to achieve precise positioning.Wafers of different specifications was selected to conduct multiple experiment on a chip sorting machine.The proposed location method was used to locate the chips on the wafer on the chip sorting equipment.The proposed method can solve the problem of chip dislocation basically,improve the chip location accuracy,and meet the needs of chip production.