摘要
针对现有双向TVS的不足及广泛的市场需求,采用集成器件结构和先进工艺研制了一款双向击穿电压7 V,电源Vcc对地GND的电容0.8 pF的超低电容TVS器件。该器件实质是普通二极管和稳压管的串并联电路,反向漏电可达到纳安级,反向动态电阻可达到10Ω以内。芯片尺寸控制在220μm×220μm以内,适合DFN1006、DFN0603等小型封装。利用此特性,该双向超低电容TVS器件适合于高频千兆网口接口的保护,可以避免传输信号丢失。
In view of the high capacitance of bidirectional TVS and extensive market demand,a 7 V symmetrical breakdown voltage and 0.8 pF ultra-low capacitance TVS device was developed and fabricated by using integrated device structure and advanced technological process.Its equivalent circuit is essentially a series and parallel circuit of diodes and zener diodes.The reverse leakage of this device is within nano-ampere and the reverse dynamic resistance is less than 10Ω at the same time.The 220μm×220μm chip size suits the package types of DFN1006 and DFN0603.According to such characteristic,this device is convenient for protecting 1000 Mbit Ethemet interface and avoiding signal missing when transmitting.
作者
徐敏杰
周琼琼
葛伟坡
韩健
XU Minjie;ZHOU Qiongqiong;GE Weipo;HAN Jian(Hangzhou Shilan Multichip Co.,Ltd.,Hangzhou Zhejiang 310018,China)
出处
《电子器件》
CAS
北大核心
2021年第4期779-781,共3页
Chinese Journal of Electron Devices
关键词
TVS器件
集成
击穿电压
超低电容
TVS device
integration
breakdown voltage
ultra-low capacitance