磁控溅射AlCrFeNiTi高熵合金薄膜的组织和表面形貌

Microstructure and surface morphology of magnetron-sputtered AlCrFeNiTi high-entropy alloy film

用直流磁控溅射法在单晶硅片上制备了AlCrFeNiTi高熵合金薄膜,采用X射线衍射仪、扫描电镜和原子力显微镜考察了溅射参数对薄膜结构及表面形貌的影响。结果表明,当溅射功率一定,随着衬底温度升高,AlCrFeNiTi高熵合金薄膜由非晶向2个BCC相转变,衍射峰强度也随之增大,同时薄膜的结晶度提高,晶粒尺寸增大,导致薄膜粗糙度增加。当衬底温度一定时,随着溅射功率增大,X射线衍射峰强度大幅度上升,薄膜表面晶粒迅速长大,但因为溅射功率过大会导致表面形成缺陷,所以表面粗糙度先减小后增大。

AlCrFeNiTi high-entropy alloy films were deposited on monocrystalline silicon wafers by magnetron sputtering.The effects of some sputtering parameters on the microstructure and surface morphology of the film were studied by X-ray diffraction, scanning electron microscopy, and atomic force microscopy. The results showed that when the sputtering power was constant, the crystal structure of AlCrFeNiTi high-entropy alloy film changed from amorphous to two BCC phases with the increasing of substrate temperature. Meanwhile, the diffraction peak intensity, crystallinity, and grain size of the film were increased, resulting in an increase in roughness of the film. When the substrate temperature was constant, the intensity of X-ray diffraction peak was increased greatly and the crystal grains grew larger rapidly with the increasing of sputtering power. However, a number of defects were formed on the film surface due to the excessive sputtering power. Therefore, the surface roughness of the film was decreased initially and then increased.