高温聚合物薄膜电容器介电材料评述与展望

High-temperature Polymer Dielectrics for Film Capacitors: Review and Prospect

聚合物电介质材料以其高充放电速率、高功率密度、高击穿场强和自愈性等优点被广泛应用于静电电容器中。然而新能源汽车、光伏并网、油气勘探、航空航天等应用对聚合物电容器在高温下的介电储能性能提出了更高的要求。为此介绍了电介质材料的基本物理背景,综述了一些典型的高温介电聚合物,重点介绍了介电聚合物复合材料,包括表面处理聚合物、基于填料形貌分类的聚合物基纳米复合材料、三明治结构复合材料和聚合物–分子半导体全有机复合材料。还对复合材料的电荷注入和输运特性与基体和纳米粒子的界面微区特性的最新研究进展进行了介绍。最后对高温聚合物电介质材料的发展现状和存在的挑战进行了简要总结。

Dielectric polymer materials are widely used in electrostatic capacitors because of their advantages such as high charge and discharge rate, high power density, high breakdown strength and self-healing properties. Recently, higher requirements for dielectric energy storage performance of polymer film capacitors at high temperatures are put forward to meet the applications in new energy vehicles, photovoltaic grid-connection, oil and gas exploration, aerospace and other applications. In this paper the basic physical background of dielectric materials is introduced, and some typical high temperature dielectric polymers are reviewed, especially dielectric polymer composites, including surface treated polymer films, polymer-based nanocomposites based on morphology classification of fillers, sandwich-structured composite materials and polymer-molecular semiconductor all-organic composites. Recent advances in charge injection and transport properties of composites and interfacial micro-region properties between polymers and nanoparticles are also reviewed.