分段加热对废旧线路板熔焊影响的数值模拟

Desoldering of Waste PCBs Heated by Segmented Heating Based on Numerical Simulation

近年来电子产业发展正存在着消耗量大、消耗快速、浪费严重等不利情况。在电子废弃物中,废旧手机芯片仍具有一定的剩余寿命,拥有较高的再利用价值。因此在废旧手机的拆解过程中提高拆解效率以及降低对芯片的损害是十分有必要的。针对废旧手机线路板上电子元器件拆解过程中常见的熔焊问题,以空气为加热介质,BGA返修台为加热工具,并采用FLUENT软件进行模拟研究。分析对比了不同预热温度、保温时间和高温加热条件下焊点熔化对于芯片拆卸效果的影响。研究结果表明,当预热温度为433 K,保温时间为40 s,高温加热温度为513 K时,拆卸效果最好。

In recent years, there are some disadvantages in the development of electronic industry, such as large consumption, rapid consumption, serious waste and so on. Among the electronic wastes, waste mobile phone chips still have a certain residual life and have high reuse value. Therefore, it is very necessary to improve the disassembly efficiency and reduce the damage to the chip in the disassembly process of waste mobile phones. Aiming at the common welding problems in the disassembly of electronic components on the circuit board of waste mobile phones, taking air as the heating medium, BGA repair bench as the heating tool, FLUENT software is used for simulation research. The effects of solder joint melting on chip disassembly under different preheating temperature, holding time and high temperature heating conditions are analyzed and compared. The results show that the disassembly effect is the best when the preheating temperature is 433 K, the holding time is 40 s and the high temperature heating temperature is 513 K.