湿法球磨工艺对CeO_(2)粒度分布及抛光性能的影响

Influence of wet ball milling process on CeO_(2) particle size distribution and polishing performance

抛光粉粒度与其抛光性能有密切关系,然而粒度相同的抛光粉,粒度分布的不同对其抛光性能也具有重要影响。为了探究粒度分布对抛光性能的影响,以粒径较大的CeO_(2)粉为原料,使用不同球磨设备对CeO_(2)粉进行细化,设置不同的球磨工艺参数并添加不同的助剂,获得中位粒径D50=1μm,具有不同粒度分布的CeO_(2)料液,添加一定量分散剂调配成固含量10%(质量分数)的抛光液。用9B双面抛光机对K9玻璃进行抛光,记录玻璃单位时间质量减少量,并利用原子力显微镜测量抛光表面粗糙度。结果表明,设置不同的球磨工艺可以对CeO_(2)粒径分布进行调控,CeO_(2)粒度分布较窄时,具有较高的抛光去除率MRR,粒度分布适中时,兼具抛光效率与表面质量。使用行星式搅拌球磨机,选用直径为3mm的磨珠、球料比为5∶1,抛光机转速为30rpm,浆液流速为30rpm、并在球磨介质中添加质量比为0.1%的聚丙烯酸钠作为助剂时,可获得最低的表面粗糙度Ra=0.849nm。

The particle size of polishing powder is closely related to its polishing performance.However,the different particle size distributions of polishing powder with the same particle size also have important impact on its polishing performance.In order to explore the impact of particle size distribution on polishing performance,the CeO_(2) powder with large particle size was used as the raw material,and refined by different ball milling equipment with different ball milling process parameters and different additives.CeO_(2) powders with D50 of 1μm and different particle size distribution was obtained,a certain amount of dispersant was add to it to prepare polishing liquid with a solid content of 10%.Polish the K9 glass with 9 B double-sided polishing machine,recorded the glass mass reduction per unit time,and measured the polished surface roughness with atomic force microscope.The results showed that the CeO_(2) particle size distribution could be adjusted by setting different ball milling processes.When the CeO_(2) particle size distribution was narrow,it had a higher polishing removal rate.When the particle size distribution was moderate,it had both polishing efficiency and surface quality.Using planetary agitating ball mill,chose 3 mm diameter beads,ball-to-material ratio of 5∶1,polisher speed of 30 rpm,slurry flow rate of 30 rpm,and added sodium polyacrylate with a mass ratio of 0.1%to the ball mill medium,the lowest surface roughness Ra=0.849 nm could be obtained.