蝶形光通信激光器的耦合规律与封装工艺研究

Research on coupling mechanism and packaging process of butterfly optical communication laser

为了研究蝶形光通信激光器的耦合机理,建立了芯片-透镜-单模光纤仿真模型,以耦合理论为基础,引入了容忍度概念,分析了空间位置误差对耦合效率的影响。通过对比透镜与光纤的各个方向的容忍度大小,结合焊后偏移现象,提出了先透镜后光纤的封装顺序,并搭建了实验平台进行验证。结果表明,在对比实验中,透镜优先封装所得到的功率最高可达1800μW,而光纤优先封装最高功率仅为1200μW;先对透镜进行封装,焊后偏移的效果要更好。该研究为蝶形器件实际封装生产提供可靠的参考。

In order to study the coupling mechanism of butterfly optical communication lasers,a chip-lens-single mode fiber simulation model was established.Based on the coupling theory,the concept of tolerance was introduced,and the effect of space position error on coupling efficiency was analyzed.By comparing the tolerance that the lens and the fiber in each direction,combined with the offset phenomenon after welding,the packaging sequence that the lens first and then the fiber was proposed,and an experimental platform was built for verification.The results show that in the comparison experiment,the maximum power obtained by lens priority package is 1800μW,while the maximum power obtained by fiber priority package is only 1200μW.The effect of the offset after welding is better when the lens is encapsulated first.This research provides a reliable reference for the actual packaging and production of butterfly devices.