TC17钛合金中空构件连接成形工艺参数优化

Optimization on parameters of bonding forming process for TC17 titanium alloy hollow component

合理的连接成形工艺参数是保证中空构件连接质量与结构完整性的关键。采用中心复合实验设计方法与有限元模拟技术,实现了TC17钛合金中空构件连接成形过程的数值模拟,基于响应面模型实现了工艺参数的优化。研究结果表明:温度升高对中空构件连接成形过程中FPI的塑性应变的增大作用和FPII的塑性应变的减小作用显著;变形量增大提高了FPI的塑性应变的增加率,延缓了FPII的塑性应变的增加率;以温度和变形量为响应变量,建立了中空构件连接成形过程中平均塑性应变ε_(FPI)和界面连接率显著增长结束时的响应参量fFPII的响应面模型,工艺参数优化的合理温度为1073 K、变形量为0.510~0.631 mm。响应面模型的拟合优度R^(2)达到99%以上,表明工艺参数优化结果是可靠的。

To ensure the connection quality and structural integrity of hollow components,the key is to determine reasonable parameters of bonding forming process.Based on the central composite experimental design method and finite element simulation technology,the numerical simulation of the bonding forming process for TC17 titanium alloy hollow component was conducted,and the optimization on process parameters was carried out based on the response surface model.The results show that the plastic strain at the first characteristic point FPI increases greatly and the strain at the second characteristic point FPII decreases greatly with the increasing of temperature,and the rate of increase in the plastic strain at the first characteristic point FPI increases and the rate of increase in the plastic strain at the second characteristic point FPII decreases with the increasing of deformation degree in the bonding forming process of hollow component.By using the temperature and deformation degree as the corresponding variables,a response surface model of the average plastic strainε_(FPI)and response parameter fFPII at the ending time of the quick increase for the bonding rate of interface during the bonding forming process of hollow component was established.After optimization of process parameters,the optimal temperature is about 1073 K and the deformation degree is in the range of 0.510-0.631 mm.The goddnes of fit R^(2)of response surface model is more than 99%showing that the optimization results of process parameters are reliable.