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高光泽度的硅酸腐片制备研究

Research on Acid Etching Wafer With the High Glossiness
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摘要 为提高酸腐片光泽度和实现稳定量产,通过优化硅单晶片加工流程,将双面研磨硅片进行旋转磨削加工,然后对该硅片进行酸性腐蚀;制备的酸腐片表面光泽度达到360 Gu以上(反射率大于98%),腐蚀液的寿命延长到50 000片;该制备技术使得酸腐片的应用领域得到拓展,并降低生产成本和提高生产效率。 In order to improve the glossiness of acid etched wafer and achieve stable mass production, by optimizing process of producing silicon wafer, rotate and grind the wafer to be double-sided grinding wafer, then acid etch the wafer. The glossiness of acid etched wafer reached more than 360 Gu(reflectivity greater than 98%) and the service life of etchant was extended to 50 000 wafers.The application field of acid etching wafer was expanded, the processing cost of products was reduced and the processing efficiency of products was improved.
作者 由佰玲 孙希凯 邓春星 周迎朝 董楠 原宇乐 谢艳 YOU Bailing;SUN Xikai;DENG Chunxing;ZHOU Yingzhao;DONG Nan;YUAN Yule;XIE Yan(Tianjin Zhonghuan Advanced Material and Technology Co.,Ltd.,Tianjin 300384,China)
出处 《机车电传动》 北大核心 2021年第5期138-141,共4页 Electric Drive for Locomotives
关键词 酸腐片 旋转磨削 移除量 损伤层 反射率 acid etching wafer rotating grinding removal damage layer reflectivity
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  • 1孙晓峰,王海燕,卢景霄,李维强.大面积多晶硅绒面的制备[J].半导体光电,2004,25(3):197-200. 被引量:12
  • 2谢书银,石志仪.硅片表面状态与机械强度[J].稀有金属,1995,19(4):312-315. 被引量:3
  • 3何雅全 吴明根.超精密加工技术基础[M].北京:超精密加工技术国防科技重点实验室,1993..
  • 4郭东明 康仁科 金洙吉.大尺寸硅片的高效超精密加工技术[A]..中国机械工程学会2002年年会论文集[C].机械工业出版社,2002.12.
  • 5P.O.Hahn. The 300 mm silicon wafer-A cost and technology challenge[J],Microelectronic Engineering, 2001(56): 3~13
  • 6Shayne La Force. Meeting market Requirements through innovation[J]. The new DBC Process,TAP technology, 2001:71~73.
  • 7Ernst Gaulhofer,Heinz Oyrer. Wafer thinning and strength enhancement to meet emerging packaging requirements[C],IEMT Europe 2000 Symposium,April,06~07,Mynich, Germany.
  • 8H.K.Tonshoff, W.V.Schmieden, et al., Abrasive Machining of Silicon[C]. Annals of CIRP Vol.1990,39(2):621~634.
  • 9S.Matsui. An experimental study on the grinding of silicon wafer-the wafer rotation grinding method (1st report). Bull. Japan Soc. Prec. Eng. 1988,22(4):295~300.
  • 10Z..J.Pei, Alan Strasbaugh. Fine grinding of silicon wafers[J]. International Journal of Machine Tools and Manufacture 2001,41:659~672.

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