摘要
为提高酸腐片光泽度和实现稳定量产,通过优化硅单晶片加工流程,将双面研磨硅片进行旋转磨削加工,然后对该硅片进行酸性腐蚀;制备的酸腐片表面光泽度达到360 Gu以上(反射率大于98%),腐蚀液的寿命延长到50 000片;该制备技术使得酸腐片的应用领域得到拓展,并降低生产成本和提高生产效率。
In order to improve the glossiness of acid etched wafer and achieve stable mass production, by optimizing process of producing silicon wafer, rotate and grind the wafer to be double-sided grinding wafer, then acid etch the wafer. The glossiness of acid etched wafer reached more than 360 Gu(reflectivity greater than 98%) and the service life of etchant was extended to 50 000 wafers.The application field of acid etching wafer was expanded, the processing cost of products was reduced and the processing efficiency of products was improved.
作者
由佰玲
孙希凯
邓春星
周迎朝
董楠
原宇乐
谢艳
YOU Bailing;SUN Xikai;DENG Chunxing;ZHOU Yingzhao;DONG Nan;YUAN Yule;XIE Yan(Tianjin Zhonghuan Advanced Material and Technology Co.,Ltd.,Tianjin 300384,China)
出处
《机车电传动》
北大核心
2021年第5期138-141,共4页
Electric Drive for Locomotives
关键词
酸腐片
旋转磨削
移除量
损伤层
反射率
acid etching wafer
rotating grinding
removal
damage layer
reflectivity