无铅焊点可靠性的研究进展

Research progress on reliability of lead-free soldered joints

文中根据近两年来国内无铅钎料研发过程中存在的问题,简要评述了无铅钎料的研究进展及发展趋势,并着眼于焊点可靠性对无铅钎料进行了评述。首先介绍影响无铅焊点可靠性的因素;其次汇集了2012~2018年国内学者对无铅钎料焊点可靠性的研究方法及研究成果,并结合加载载荷及热循环共同作用、有限元模拟分析、电迁移及锡须生长影响无铅焊点性能的4个方面对无铅焊点可靠性进行了分析;最后结合以上研究成果针对无铅钎料的未来发展进行展望,为新型无铅钎料的进一步研究提供理论支撑。

Based on the problems existing in the research and development of lead-free solders in China in recent two years,research progress and development trend of lead-free solders was briefly reviewed in this paper,and the lead-free solders focusing on the reliability of soldered joints was reviewed.Factors affecting the reliability of lead-free solder joints were firstly introduced in this paper.Research methods and achievements of domestic scholars on the reliability of lead-free solder joints from 2012~2018 year were secondly collected.Reliability of lead-free soldered joints was analyzed from four aspects that affected performance of lead-free soldered,namely joints loading and thermal cycling,finite element simulation,electrical migration and tin whisker growth.Based on the above research results,the future development of lead-free solders was finally prospected,which provided theoretical support for further research of new lead-free solders.