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键合金丝可靠性强化试验失效机理仿真分析 被引量:2

Simulation Analysis of the Failure Mechanism of the Gold Bonding Wire Reliability Enhancement Testing
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摘要 针对某组件可靠性强化振动试验过程中键合金丝断裂的现象,建立了键合金丝的有限元模型。利用有限元软件Ansys Workbench分析了键合金丝在不同方向随机振动激励载荷作用下的应力分布情况,并基于Palmgren-Miner线性累积损伤定律计算了键合金丝的疲劳损伤指数。疲劳损伤结果表明可靠性强化振动试验过程中键合金丝由于振动疲劳对其造成损伤导致其根部断裂,分析结果对后期组件的金丝优化设计、提高金丝的可靠性具有指导意义。 Aiming at the phenomenon of bond alloy wire fracture during the reliability enhancement vibration test of a component,a finite element model of the bond alloy wire is established.The finite element software Ansys Workbench is used to analyze the stress distribution of the bond alloy wire under random vibration excitation loads in different directions,and the fatigue damage index of the bond alloy wire is calculated based on the Palmgren-Miner linear cumulative damage law.The fatigue damage results show that the bond alloy wire is damaged due to vibration fatigue during the reliability enhancement vibration test,and its roots are broken.The analysis results have guiding significance for the optimization of the gold wire design of the later components and the improvement of the reliability of the gold wire.
作者 王成 尹洪波 毛冰晨 WANG Cheng;YIN Hongbo;MAO Bingcheng(NO.723 Institute of China Shipbuilding Industry Corporation,Yangzhou 225001,China)
出处 《电子产品可靠性与环境试验》 2021年第5期14-18,共5页 Electronic Product Reliability and Environmental Testing
关键词 键合金丝 有限元分析 随机振动 疲劳损伤 gold bond wire finite element analysis random vibration fatigue damage
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