基于粘接相复配的低温固化导电银浆综合性能的研究

Study on comprehensive properties of low temperature curing conductive silver paste based on composite bonding phase

采用聚酯树脂(PE)、热塑性聚氨酯弹性体(TPU)和聚甲基丙烯酸甲酯(PMMA)复配胶粘剂相,以银粉作为导电相,制备导电银浆。通过丝网印刷技术将其印刷于聚酰亚胺(PI)薄膜上,测试银线的电阻率、硬度、印刷适性以及银薄膜的附着性。研究结果表明:粘接相的组成对银浆的性能有较大的影响,当w(银粉)=48%(相对于总质量而言),m(PE)∶m(TPU)∶m(PMMA)=10∶6∶3时,银线电阻率为2.62×10^(-6)Ω·m,硬度为6H、附着性为5B,且具有优异的耐弯折性和印刷适性。

Conductive silver paste was prepared by using polyester resin(PE),thermoplastic polyurethane elastomer(TPU)and polymethyl methacrylate(PMMA)as composite bonding phase and silver powder as conductive phase.It was printed onto polyimide(PI)film by screen printing technology,and the electrical resistivity,hardness,printability of the silver line and adhesion of the silver film were tested.The research results showed that the composition of bonding phase had a great impact on the properties of silver paste.When w(silver powder)=48%(relative to the total mass),m(PE)∶m(TPU)∶m(PMMA)=10∶6∶3,the resistivity of the silver line was 2.62×10^(-6)Ω·m,the hardness was 6 H,the adhesion was 5 B,and it had excellent bending resistance and printability.