Study on Welding-Bead Bonding Strength of Laser-Stacking Copper-Aluminum Heterogeneous Electrode Plates

In this paper,two types of copper-aluminum heterogeneous electrode plates are stacked and the finite element analysis(FEA)models of two different laser welding conditions are built by using SYSWELD welding simulation software to calculate the depth of the welding bead and the temperature distribution of the welding surface.Then,the residual stress analysis data of the welded area are exported and the residual stress is applied to the welded specimen for CAE analysis to ensure that the welding bonding strength meets the design target of a shear force of 500 N or higher.The copper-aluminum laser-stacking simulation technique in this paper can be applied to the manufacturing of copper-aluminum heterogeneous laser-welded electrodes and series-connected electrodes of automotive lithium-ion power battery modules,providing an effective analysis method for welding bonding-strength.