双马来酰亚胺树脂基电子封装模塑料研究

Study on bismaleimide resin based molding compounds for electronic packaging

以双马来酰亚胺树脂为基体树脂,2,2′-二烯丙基双酚A为改性剂,研究了树脂/改性剂比例、固化促进剂及其用量对体系固化行为的影响,然后将树脂体系用于电子封装模塑料制备,并将产品性能与环氧模塑料进行了对比。结果表明,以咪唑作为固化促进剂,用量为体系总质量的3%时,不同树脂/改性剂比例体系的非等温固化放热峰均在200℃以下,满足现行环氧模塑料固化工艺要求。通过配方设计得到的双马来酰亚胺树脂基模塑料固化物的玻璃化转变温度(Tg)可达256℃,热分解温度(Td1%)可达415℃,与环氧模塑料相比,Tg和Td1%分别提高了109℃和21℃,固化物耐热性能优异,同时具有较好的粘附强度和介电性能,在高功率器件封装领域具有良好的应用前景。

Using bismaleimide resin as matrix resin and 2,2′-diallyl bisphenol A as modifier,the effects of resin/modifier ratio,curing accelerator and its amount on the curing behavior of the system were investigated.And then the resin system was used for the preparation of electronic packaging molding compounds,and the product performance was compared with that of epoxy molding compounds.The results showed that when imidazole was used as a curing accelerator and the amount was 3%of the total mass of the system,the non-isothermal curing exothermic peaks of different resin/modifier ratio systems were all below 200℃,which met the requirements of the current epoxy molding compound curing process.The glass transition temperature(Tg)and thermal decomposition temperature(Td1%)of the cured bismaleimide resin base molding compound obtained by formula design could reach 256℃and 415℃,respectively.Compared with epoxy molding compound,the Tgand Td1%were increased by 109℃and 21℃,respectively.The cured product had excellent heat resistance,good adhesion strength and dielectric properties.It had good application prospects in the field of high-power device packaging.