摘要
针对低温铅锡银(Sn63Pb35Ag2)焊料再流焊可靠性需求,使用铂银浆料在氧化铍(BeO)基板上制作焊盘。对焊接膜层进行焊接浸润性、焊接切面微观形貌、剪切强度、高温存储和温度循环等考核项验证,铂银焊盘的可靠性可满足国军标(GJB)标准要求。
Based on the reliability requirements of low temperature reflow soldering with Sn63Pb35Ag2,the soldering pads using platinum silver pastes have been prepared on beryllia(BeO)substrate.After the testing of soldering wettability,microstructure of soldering interface,shear strength,high temperature storage and temperature cycling,thick film quality are verified.It is found that the reliability of platinum silver pad can fully meet the national military standard.
作者
吴鑫
李创
袁海
任英哲
WU Xin;LI Chuang;YUAN Hai;REN Yingzhe(The 771st Research Institute of CASC,Xi’an 710119,China)
出处
《电子工艺技术》
2021年第6期341-343,348,共4页
Electronics Process Technology
基金
装备发展预研项目(61409230310)。
关键词
氧化铍基板
铂银焊盘
剪切强度
可靠性
BeO substrate
platinum silver pad
shear strength
reliability
