摘要
文章主要分析了激光直接成像(LDI)生产制造中造成孔无铜缺陷及改善预防措施,并且详细介绍了如何通过设备改造降低LDI生产过程中导致镜头雾化的孔无铜异常。
The article mainly analyzes the hole-free copper defects in LDI manufacturing and the improvement and preventive measures,and introduces in detail how to reduce the defect of no copper in hole caused by lens fogging in the LDI production process through equipment modification.
作者
许校彬
樊佳
Xu Xiaobin;Fan jia(Glorysky Electronic Technology Co.,Ltd.Guangdong Huizhou 516369)
出处
《印制电路信息》
2021年第11期6-9,共4页
Printed Circuit Information
关键词
激光直接成像
镀通孔无铜
改善措施
LDI
Plated Through-Hole Copper-Free
Improvement Measures
