摘要
文章针对PCB图形电镀工序二次铜电镀出现的通孔孔内铜异常,通过对各种影响因素的对比试验,得出了产生通孔电镀铜异常的影响因素,为二次铜电镀过程中出现的通孔镀铜异常提供改善和预防措施。
By analysis of the causes of during pattern platting,and by comparative tests,the paper verified the real causes of electrodeposition fail in through-hole.The improvement and preventive measure are given accordingly.
作者
谢慈育
宗高亮
王扩军
李得志
冉光武
Xie Ciyu;Zong Gaoliang;Wang Kuojun;Li Dezhi;Ran Guangwu
出处
《印制电路信息》
2021年第11期31-34,共4页
Printed Circuit Information
关键词
图形电镀
二次镀铜
镀铜异常
Pattern Platting
Copper Platting
Fail-Electrodeposition
Through-Hole
