粉末冶金法制备SiCp/Cu复合材料及组织性能研究

Microstructure and properties of SiCp/Cu composites prepared by powder metallurgy

以高纯SiC粉、Cu粉为原料,通过机械球磨、真空热压烧结制备SiC颗粒弥散强化铜基(SiCp/Cu)复合材料。采用SEM、XRD等方法,研究了球磨粉末形貌、粒度及成分均匀性的变化规律,同时研究了真空热压烧结SiCp/Cu复合材料微观组织、力学性能和物理性能。结果表明:球磨转速为250 r/min、球料比为10:1(质量比)时,球磨10 h获得的SiC/Cu复合粉末成分均匀,无团聚现象;真空热压烧结复合材料的相对密度达到92%以上,SiC颗粒均匀弥散分布,具有很好的力学性能和导热导电性能;其中,烧结温度850℃、保温1 h制备的材料综合性能更佳,致密度达到96.2%,热导率为221.346 W/(m·K),电导率为65.3%IACS,抗压强度为467.46 MPa,断裂应变可达20.87%。

SiC particle dispersion strengthened copper matrix(SiCp/Cu)composites using high purity SiC powder and Cu powder as raw materials were prepared by mechanical ball milling and vacuum hot pressing sintering.SEM and XRD were used to study the change of powder morphology,powder uniformity and average particle size during ball milling.At meantime,the microstructure,mechanical properties and physical properties of SiCp/Cu composites prepared by vacuum hot pressing sintering process were studied.The results show that the composition of SiCp/Cu composite powder is uniform after 10 h ball milling with the ball milling speed of 250 r/min and the ratio of ball to material 10:1(mass ratio).The relative density of the composites prepared by vacuum hot pressing sintering is more than 92%,and the SiC reinforced particles are evenly distributed,which has good mechanical properties and thermal conductivity.Among which,the composite prepared at 850℃for 1 h has better comprehensive properties,with density of 96.2%,thermal conductivity of 221.346 W/(m·K),conductivity of 65.3%IACS,compressive strength of 467.46 MPa and fracture strain of 20.87%.