摘要
针对微装配连接中高黏胶液微量分配的难题,研究了静电诱导加载与微力反馈转移技术与设备。通过静电力加载胶滴的仿真模型,计算分析了转印头距离胶面的初始高度、电流等参数对胶液加载转移过程的影响,结合力反馈转移胶滴的工艺,确定了微量高黏胶分配的技术指标和关键元件。设计了高黏胶液微量分配工艺流程,研制了微量胶液分配样机的硬件结构和控制软件。最后,以环氧树脂胶为样品进行胶液的微量分配实验,结果表明:通过调整液膜-转印头之间的高度和触发液桥拉断的阈值电流,可以控制加载胶滴和转移胶滴量,转移胶滴的半径可控制在96~193μm,体积控制在0.43~2.81 nL,分配的胶滴半径的一致性误差为4%。该技术为解决皮升至纳升级高黏胶液的微量分配提供了新途径。
To solve the problem of high-viscous adhesive micro-dispensing for micro-assemblies,the technology and equipment of electrostatic loading and force feedback are presented.With finite element modeling simulations,the influences of factors such as the initial height of the transfer head from the adhesive surface and current on the adhesive droplet-loading and transferring process were analyzed.The main specifications and key components for the dispensing process were determined,and the complete micro-dispensing process was constructed.Moreover,both the hardware framework and control software for the prototype machine were developed.Finally,micro-dispensing experiments for epoxy resin adhesive were performed to verify the performance of the device.Experimental results show that the volume and radius of the loading and transferring droplet can be controlled by the initial height and threshold current that trigger the breakup of the liquid bridge.The radius and volume of the transferred droplet can be controlled in the range of 96-193μm and 0.43-2.81 nL,respectively.The consistency error of the final-transferred droplet is 4%.The novel method and device can significantly improve the performance of high-viscous adhesive micro-dispensing.
作者
徐征
钱艳文
秦少春
王晓东
徐晓羽
XU Zheng;QIAN Yan-wen;QIN Shao-chun;WANG Xiao-dong;XU Xiao-yu(School of Mechanical Engineering,Dalian University of Technology,Dalian 116085,China)
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2021年第10期2386-2392,共7页
Optics and Precision Engineering
基金
国家自然科学基金资助项目(No.51975102)。
关键词
微装配
高黏胶液
微量分配
静电诱导
力反馈
micro assembly
high-viscosity liquid
micro-dispensing
electrostatic induction
force feedback