面向异质集成的纳米修饰互连技术

Nano-modification interconnection technology for heterogeneous integration

异质集成在成本和可制造性等方面具有优势,是延续摩尔定律发展的重要技术路线,片间互连技术是异质集成的关键技术之一。首先介绍了片间互连的Cu-Cu键合技术及发展概况;接着重点介绍了一种面向异质集成的具有自主知识产权的纳米修饰互连技术,并介绍了该技术的研究进展,包括纳米颗粒表面形貌的表征和分析、纳米修饰互连技术的键合机理,以及纳米修饰键合技术在窄节距晶圆级图形化中的实现;最后展望了该技术在超窄节距无凸点片间互连技术中的应用前景。

Heterogeneous integration has advantages in cost and manufacturability,which is a crucial technical route to continue the development of Moore’s Law,inter-chip(wafer)interconnection is one of key technologies of heterogeneous integration.First of all,this paper introduces current development of inter-chip(wafer)interconnection,Cu-Cu bonding technology.Then,we mainly focus on a nano-modification interconnection technology with independent intellectual property rights for heterogeneous integration,and research progresses of the technology is introduced in detail,including characterization and analysis of surface morphology of nanoparticles,bonding mechanism of nano-modification interconnection technology,and realization of fine-pitch wafer-level patterning through nano-modification interconnection technology.Finally,the potential application of this technology in ultra fine-pitch inter-chip(wafer)interconnection and bumpless interconnection is prospected.