LED封装用有机硅材料的研制及性能研究

Development and Properties of Silicone Materials for LED Packaging

LED封装即是对发光芯片进行封装处理,要求所用材料能够具有良好的透光率,并保证内部灯芯完好无损,为了进一步提高封装材料的性能,更好的发挥保护效果,本文将围绕有机硅材料的研制及性能实验进行分析讨论,并总结相关实验结果,从而对材料的耐热性能和力学性能完成深入探究,确保实验材料能够在LED封装领域得到良好的运用。

LED packaging is to package light-emitting chips,which requires materials with good light transmittance and intact inner wick.In order to further improve the performance of packaging materials and give full play to the protection effect,this paper will analyze and discuss the development and performance experiments of silicone materials,and summarize the relevant experimental results,so as to thoroughly explore the heat resistance and mechanical properties of materials,and ensure that the experimental materials can be well used in LED packaging field.